Dual (Quad-Core) Intel® "Nehalem" Xeon® processor(s)
• The new Intel® "Nehalem" architecture delivers significant performance improvements over previous technology. The memory controller is now integrated into the processor itself (rather than the chipset). It now also supports TRIPLE channel DDR-3 (12x DIMMs) ECC memory rather than the previous dual channel ECC DDR2 architecture.
Another performance boost comes from introduction of Intel® Quick Path Interconnect (QPI). This provides system bus speeds up to 6.4G transfers/s and a max bandwidth of up to 25.6GB/s! It replaces the previous Front Side Bus technology and gives significantly higher bandwidths. performance and upgradeabilty.

Up to twelve "triple channel" fully buffered 1066/1333MHz DIMMs
• Massive memory capacity and performance.

Integrated server management
• Helps lower costs by improving baseline manageability.

Up to four SATA2 3Gb/s ports
• Supporting RAID 0, 1, 5 and 10.

Hot-swap SATA2/SAS backplane with 4 hot swap drive bays
• Supports next-generation enterprise class SAS drives or lower cost SATA2 drives.

Dual Gb Ethernet
• Increases network performance, with lower processor overhead with Intel® Advanced I/O Technology.

Quick Path Interconnect
• QPI replaces the old 'Front Side Bus' - each CPU now has its own memory controller for increased system/memory bandwidth and performance.

PCI Express* I/O
• Serial I/O technology provides a direct connection between the MCH chipset and PCI Express* component/adapters with bandwidth up to 4 GB/second on each PCI Express x8 interface.
• PCI Express offers higher bandwidth, lower latency and fewer I/O bottlenecks than PCI-X

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